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LTM8023
APPLICATIONS INFORMATION
A graphical representation of these thermal resistances
is given in Figure 7.
The blue resistances are contained within the μModule
regulator, and the green are outside.
The die temperature of the LTM8023 must be lower than
the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking
of the LTM8023. The bulk of the heat flow out of the
LTM8023 is through the bottom of the module and the LGA
pads into the printed circuit board. Consequently a poor
printed circuit board design can cause excessive heating,
resulting in impaired performance or reliability. Please
refer to the PCB Layout section for printed circuit board
design suggestions.
Finally, be aware that at high ambient temperatures the
internal Schottky diode will have significant leakage current
increasing the quiescent current of the LTM8023.
JUNCTION-TO-AMBIENT RESISTANCE (JESD 51-9 DEFINED BOARD)
JUNCTION-TO-CASE (TOP)
RESISTANCE
CASE (TOP)-TO-AMBIENT
RESISTANCE
JUNCTION
JUNCTION-TO-BOARD RESISTANCE
At
μMODULE REGULATOR
JUNCTION-TO-CASE
(BOTTOM) RESISTANCE
CASE (BOTTOM)-TO-BOARD
RESISTANCE
BOARD-TO-AMBIENT
RESISTANCE
8023 F07
Figure 7
8023fi
For more information www.linear.com/LTM8023
17
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